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The GP-the EAM 2. structure and Simulations
of The EAMS the GP-Presented in the this work are based on the layers of graphene to two two separated by 35 nm of silicon nitride below a polymer waveguide . Figure 1 (a) shows the cross section of the device. In order to avoid mechanical damage to the graphene layers, the surface of the underlying substrate should be sufficiently smooth and without steep edges. As in previous work the graphene was transferred onto previously structured waveguides, either a surface planarization as in [ 5] or spin-coating of an additional layer as in [ 3] was needed to obtain a smooth substrate surface. Increases the fabrication This-effort and, in the the latter a case, Reduces the light of graphene-Interaction of due to the distance Between Increased Waveguide and of graphene.
The Fig. 1 (a) Cross section (not to scale) and (b) top view of a GP-EAM. Shows the Micrograph of The structured and contacted of graphene-silicon Nitride-of graphene stack of the fabricated Structures the before of spin-coating of the Waveguide of layer.
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It Should the BE Noted That, unlike in for LEO previous work, the layers of graphene the found here are Located the below the Waveguide and not the above. This enables the transfer of the graphene layers to the unstructured polymer bottom cladding, thus omitting the need for such surface planarization and facilitating a wafer-scale processing of graphene-based optoelectronic devices. Furthermore, the polymer waveguide and top cladding act as a cover for the active graphene layers shielding it from environmental influence.
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